The EU regulation 2002/95/EWG(RoHS) forbids the use of lead in electronics and electrical devices as of June 2006. Hereof especially the solder technology is affected.

In the meantime tested lead-free solders are available for PCB manufacturer and assembler. The operation temperature, however, will be 50 °C higher compared to common

techniques.The thermal treatment of sustrates and components wil become significantly higher.

Critical constructions, as for example thin printed circuits boards with a high rate of copper, can result in undesirable affects, such as:

• Deformation by softening

• Pad-Lifting

• Barrel cracks

• Delamination at critical interfaces

Isola has early adapted to the new requirements and assist activeley the implementation of the lead-free soldering technique with a wide offer of base material.

Please use our know-how for your individual solution!