Specification Sheet #: IPC-4101C/98/99
Reinforcement: woven E-glass
Resin system: primary: epoxy • secondary: multifunctional epoxy
Flame Retardant Mechanism: brominated epoxy resin; minimum requirement: V-0
Fillers: inorganic filler
ID Reference: UL/ANSI: FR-4; ANSI: FR-4/98 RoHS-compliant
Glass Transition (Tg): 150 °C – 200 °C
The demands relating to the reliability of printed circuit boards are increasing.
Major influences besides the actual layout and design are the thermal attributes of the base material such as the glass transition temperature (Tg), time to delamination at 260 °C (T260) and 288 °C (T288) thermal decomposition temperature (TD) and the thermal expansion behaviour in the z-axis. In many cases the reliability of printed circuit boards is determined by destructive tests, especially in automobile applications.
Typical terms are:
-40 °C up to +125 °C/> 500 cycles or
-40 °C up to +140 °C/=1.000 cycles.
It has been demonstrated that only base materials with a low expansion in the z-axis are able to pass these tests.
The base material quality PCL370HR complies with these requirements without restrictions.
For predictable reliability of printed circuit boards this material offers excellent performance in order to prevent barrel cracks, corner cracks, resin recession and other failure mechanism.